Open AccessHeat dissipation analysis of electronic equipment based on CFD
Author(s) -
Xianlong Liu,
Shengjian Tang,
Minghui Feng
Publication year - 2019
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1300/1/012112
Subject(s) - radiator (engine cooling) , dissipation , computational fluid dynamics , thermal management of electronic devices and systems , grid , mechanics , software , power (physics) , materials science , computer science , nuclear engineering , mechanical engineering , engineering , physics , thermodynamics , mathematics , geometry , programming language
In order to quantitatively analyze the heat dissipation of high-power devices, Icepak software is used for analysis. Comparing the effects of fans on heat dissipation, two models were established respectively (with fan and without fan). Combining the advantages of Icepak, the grid around the radiator is combined with structured and unstructured grid. Through the analysis, the maximum temperature decreases by 22.2°C and 36.6% when there is a fan (the flow rate is 0.003kg/s).