Open AccessEffect of flattening reduction rate of primary recrystallization microstructure and rare earth in copper-containing grain-oriented silicon steel on secondary recrystallization
Author(s) -
Zili Jin,
Huiping Ren,
Zhinan Zhang,
Zhong-wang Wu
Publication year - 2019
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1270/1/012002
Subject(s) - recrystallization (geology) , materials science , metallurgy , annealing (glass) , copper , flattening , silicon , electrical steel , microstructure , grain growth , dynamic recrystallization , hot working , composite material , geology , paleontology
The results show that the content of rare earth and the flattening reduction rate after the initial recrystallization annealing have significant effects on the secondary recrystallization process and grain growth behavior in the copper oriented silicon steel produced by the first cold rolling method. After the initial recrystallization of the oriented silicon steel containing copper, the flattening with a reduction ratio of about 9%, relatively coarse recrystallized grains are obtained after high temperature annealing. About 8 ppm of lanthanum and 3 ppm of cerium were added to the oriented silicon steel containing copper, the temperature at which the secondary recrystallization abnormally grew during the high temperature annealing was increased by 30 °C ∼50 °C . After the primary recrystallization annealing, the secondary recrystallized structure of copper-oriented silicon steel containing rare earth is relatively coarse after being flattened.