Open AccessDevelopment of a distributed ferromagnetic enhanced inductively coupled plasma source for plasma processing
Author(s) -
G. I. Sukhinin,
M. V. Isupov,
А. В. Федосеев,
I. B. Yudin
Publication year - 2019
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1243/1/012004
Subject(s) - argon , inductively coupled plasma , plasma , wafer , analytical chemistry (journal) , materials science , etching (microfabrication) , torr , plasma processing , chemistry , atomic physics , optoelectronics , chromatography , physics , nanotechnology , thermodynamics , quantum mechanics , layer (electronics)
A low frequency (∼100 kHz) distributed ferromagnetic enhanced inductively coupled plasma (FMICP) source with a separate supply of argon and chlorine into the main discharge chamber is proposed in order to obtain a large volume of dense (10 10 −10 12 cm -3 ) uniform plasma at low pressures (1−100 mTorr). Argon is activated by FMICP sources in U-shaped tubes and diffuses into the main chamber, mixing with chlorine. The Ar/Cl 2 mixture is also activated in the main discharge chamber by vortex alternating electric fields circulating in U-tubes and in the chamber. A separate supply of Ar into the side FMICP sources and Cl 2 directly into the main chamber can significantly enhance the power transfer efficiency into the main discharge chamber to be used for plasma etching of 450 mm wafers.