Open AccessResearch on thick copper CMP based on multilayer wiring of radio frequency microsystem
Author(s) -
K. Q. Qian,
H. Z. Zhang,
L. Wang,
D. R. Wang,
Mengling Huang
Publication year - 2019
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1209/1/012010
Subject(s) - materials science , copper , chemical mechanical planarization , copper interconnect , copper plating , wafer , etching (microfabrication) , microsystem , electroplating , optoelectronics , layer (electronics) , microwave , back end of line , plating (geology) , dielectric , metallurgy , composite material , nanotechnology , computer science , telecommunications , geophysics , geology