Open AccessApplication of forward five point central difference method in the temperature field model of laser processing silicon wafer
Author(s) -
Jianmin Bao,
Qingyuan Liu,
Zhenhong Jia,
Yuxing Huang,
Yuhong Long
Publication year - 2018
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1087/2/022002
Subject(s) - wafer , machining , materials science , laser , mechanical engineering , silicon , field (mathematics) , jet (fluid) , groove (engineering) , laser cutting , optics , mechanics , engineering , optoelectronics , metallurgy , physics , mathematics , pure mathematics