Open AccessWetting characterization of Flip chip’s Lead-Free Solder Interconnect Using Surface Evolver.
Author(s) -
Su-Kyum Lim,
Nurulakmal Mohd Sharif
Publication year - 2018
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1082/1/012055
Subject(s) - soldering , flip chip , interconnection , materials science , copper , miniaturization , wetting , die (integrated circuit) , thermal copper pillar bump , volume (thermodynamics) , printed circuit board , composite material , mechanical engineering , metallurgy , layer (electronics) , computer science , electrical engineering , engineering , nanotechnology , adhesive , computer network , physics , quantum mechanics