Open AccessFlow Behavior Analysis of Emc in Molded Underfill (Muf) Encapsulation for Multi Flip-Chip Package
Author(s) -
M. A. Azmi,
Moha Asri Abdullah,
M. Z. Abdullah,
Zulkifli Mohamad Ariff,
Mohd Nazari Ismail,
Mohd Sharizal Abdul Aziz
Publication year - 2018
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1082/1/012015
Subject(s) - flip chip , materials science , fluent , chip , encapsulation (networking) , electromagnetic compatibility , composite material , shear rate , chip scale package , viscosity , mechanics , electronic engineering , computational fluid dynamics , nanotechnology , engineering , electrical engineering , computer science , layer (electronics) , physics , computer network , adhesive , wafer