Open AccessAnalysis of high-temperature aging and microstructure of FC LED solder joints of a silver conductive layer bonded using SAC solder
Author(s) -
Mengtian Li,
Jun Zou,
Wengjuan Wu,
Nan Jiang,
Yiming Liu,
Liping Wang,
Mingming Shi,
Wenbo Li
Publication year - 2018
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1074/1/012003
Subject(s) - soldering , materials science , microstructure , flip chip , composite material , shear strength (soil) , scanning electron microscope , layer (electronics) , solder paste , direct shear test , metallurgy , shear (geology) , adhesive , environmental science , soil science , soil water