Open AccessThe Effects of micro Aluminum fillers In Epoxy resin on the thermal conductivity
Author(s) -
Kareem A. Jasim,
Rihab Nassr Fadhil
Publication year - 2018
Publication title -
journal of physics. conference series
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.21
H-Index - 85
eISSN - 1742-6596
pISSN - 1742-6588
DOI - 10.1088/1742-6596/1003/1/012082
Subject(s) - epoxy , materials science , composite material , thermal conductivity , mold , aluminium , molding (decorative) , filler (materials) , conductivity , chemistry