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TMAP modeling of D release from baked multi-layer Be–D co-deposits
Author(s) -
M.J. Simmonds,
M.J. Baldwin,
G. De Temmerman,
R.P. Doerner
Publication year - 2020
Publication title -
physica scripta
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.415
H-Index - 83
eISSN - 1402-4896
pISSN - 0031-8949
DOI - 10.1088/1402-4896/ab4de4
Subject(s) - layer (electronics) , materials science , geology , chemical engineering , composite material , engineering

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