
Gradient coil and radiofrequency induced heating of orthopaedic implants in MRI: influencing factors
Author(s) -
Jenny Wooldridge,
Alessandro Arduino,
Luca Zilberti,
Umberto Zanovello,
Mario Chiampi,
Valeria Clementi,
O. Bottauscio
Publication year - 2021
Publication title -
physics in medicine and biology/physics in medicine and biology
Language(s) - English
Resource type - Journals
eISSN - 1361-6560
pISSN - 0031-9155
DOI - 10.1088/1361-6560/ac3eab
Subject(s) - electromagnetic coil , radiofrequency coil , magnetic resonance imaging , field (mathematics) , implant , perpendicular , work (physics) , parametric statistics , excitation , materials science , antenna (radio) , dielectric heating , biomedical engineering , computer science , nuclear magnetic resonance , radiology , medicine , physics , surgery , optoelectronics , telecommunications , mathematics , statistics , geometry , pure mathematics , dielectric , quantum mechanics , thermodynamics
Patients with implanted orthopaedic devices represent a growing number of subjects undergoing magnetic resonance imaging (MRI) scans each year. MRI safety labelling is required for all implants under the EU Medical Device Regulations to ensure regulatory compliance, with each device assessed through standardised testing procedures. In this paper, we employ parametric studies to assess a range of clinically relevant factors that cause tissue heating, performing simulations with both radiofrequency (RF) and gradient coil (GC) switching fields, the latter of which is often overlooked in the literature. A series of ‘worst-case’ scenarios for both types of excitation field is discussed. In the case of GC fields, large volume implants and large plate areas with the field orientated perpendicular to the plane cause the highest heating levels, along with sequences with high rates of field switching. Implant heating from RF fields is driven primarily from the ‘antenna effect’, with thin, linear implants of resonant length resulting in the highest temperature rises. In this work, we show that simplifications may be made to the field sequence and in some cases the device geometry without significantly compromising the accuracy of the simulation results, enabling the possibility for generic estimates of the implant heating for orthopaedic device manufacturers and opportunities to simplify the safety compliance process.