Open AccessBonding Methods for Chip Integration with Parylene Devices
Author(s) -
James Jung Yoo,
Ellis Meng
Publication year - 2021
Publication title -
journal of micromechanics and microengineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.494
H-Index - 132
eISSN - 1361-6439
pISSN - 0960-1317
DOI - 10.1088/1361-6439/abe246
Subject(s) - parylene , materials science , epoxy , electronics , testbed , flexible electronics , chip , wire bonding , polymer , optoelectronics , composite material , nanotechnology , computer science , electrical engineering , engineering , telecommunications , computer network
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