Open AccessReliability of spring interconnects for high channel-count polyimide electrode arrays
Author(s) -
Safiullah Khan,
Juan S. Ordonez,
Thomas Stieglitz
Publication year - 2018
Publication title -
journal of micromechanics and microengineering
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.494
H-Index - 132
eISSN - 1361-6439
pISSN - 0960-1317
DOI - 10.1088/1361-6439/aaaf2c
Subject(s) - polyimide , materials science , contact resistance , electronics , electrode , gasket , interconnection , substrate (aquarium) , layer (electronics) , composite material , silicone rubber , spring (device) , optoelectronics , electrical engineering , computer science , mechanical engineering , engineering , telecommunications , chemistry , oceanography , geology