
Layer transfer by controlled spalling
Author(s) -
Stephen W. Bedell,
K. Fogel,
Paul Lauro,
Davood Shahrjerdi,
J. A. Ott,
D. K. Sadana
Publication year - 2013
Publication title -
journal of physics. d, applied physics
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.857
H-Index - 198
eISSN - 1361-6463
pISSN - 0022-3727
DOI - 10.1088/0022-3727/46/15/152002
Subject(s) - materials science , wafer , substrate (aquarium) , layer (electronics) , spall , fracture (geology) , electronic circuit , brittleness , ultimate tensile strength , optoelectronics , composite material , electrical engineering , engineering , oceanography , geology