Open AccessResidual polymer effect on shallow trench Bosch process stability
Author(s) -
Chan-Yun Lee,
Andy Shen
Publication year - 2020
Publication title -
aip advances
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/6.0000156
Subject(s) - trench , wafer , residual , etching (microfabrication) , polymer , shallow trench isolation , deposition (geology) , process (computing) , computer science , materials science , process engineering , sequence (biology) , mechanics , biological system , nanotechnology , mechanical engineering , algorithm , chemistry , composite material , engineering , physics , geology , layer (electronics) , sediment , biology , operating system , paleontology , biochemistry
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