Open AccessUnderstanding residual stress in thin films: Analyzing wafer curvature measurements for Ag, Cu, Ni, Fe, Ti, and Cr with a kinetic model
Author(s) -
Zhaoxia Rao,
Sarah Berman,
Peilin Yang,
Diederik Depla,
Eric Chason
Publication year - 2021
Publication title -
journal of applied physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.699
H-Index - 319
eISSN - 1089-7550
pISSN - 0021-8979
DOI - 10.1063/5.0058919
Subject(s) - residual stress , curvature , materials science , wafer , grain boundary , stress (linguistics) , thin film , work (physics) , metallurgy , thermodynamics , mathematics , geometry , microstructure , physics , nanotechnology , linguistics , philosophy
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