Open AccessMolecular dynamics investigation of the slip flow liquid–solid interfacial thermal conductance
Author(s) -
Zhenyu Wang,
Shangwei Sun,
Yifan Cui,
Ran Ran,
Yongzhi Zhao
Publication year - 2021
Publication title -
aip advances
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/5.0050291
Subject(s) - slip (aerodynamics) , slip ratio , materials science , graphite , molecular dynamics , heat flux , heat transfer , thermal conductivity , thermodynamics , conductance , interfacial thermal resistance , thermal , composite material , thermal resistance , mechanics , shear stress , chemistry , condensed matter physics , physics , computational chemistry
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