Open AccessAnalytical thermal resistance model for calculating mean die temperature of eccentric quad flat no-leads packaging on printed circuit board
Author(s) -
Yongchao Wang,
Xin Wei,
Guohao Zhang,
Zhengfa Hu,
Zhongwei Zhao,
Lei Wang
Publication year - 2021
Publication title -
aip advances
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/5.0043051
Subject(s) - quad flat no leads package , die (integrated circuit) , printed circuit board , microelectronics , thermal resistance , electronic packaging , thermal conductivity , materials science , mechanical engineering , thermal , heat transfer , electronic engineering , engineering , electrical engineering , composite material , mechanics , optoelectronics , thermodynamics , physics , adhesive , layer (electronics)
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