Open AccessInfluence of temperature on the soldering process of CLCC-3 package components using AuSn20 solder
Author(s) -
Zhihuan Zhao,
Guanghao Gong,
Mingming Jiang,
Chuanzhong Chen,
Peng Li,
Weihai Song,
Zhibin Zhao,
Li Zhang,
Huijun Yu
Publication year - 2020
Publication title -
aip advances
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/5.0005312
Subject(s) - soldering , materials science , eutectic system , reflow soldering , solder paste , metallurgy , composite material , microstructure
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