Open AccessMeasuring the surface bonding energy: A comparison between the classical double-cantilever beam experiment and its nanoscale analog
Author(s) -
Konstantinos Pantzas,
Frank Fournel,
A. Talneau,
G. Patriarche,
Éric Le Bourhis
Publication year - 2020
Publication title -
aip advances
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/1.5143843
Subject(s) - cantilever , microelectronics , wafer , materials science , annealing (glass) , wafer bonding , silicon , fabrication , semiconductor , anodic bonding , nanoscopic scale , silicon on insulator , optoelectronics , photonics , microelectromechanical systems , nanotechnology , composite material , medicine , alternative medicine , pathology
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