Open AccessCorrelating thermoelectric (Bi,Sb)2Te3 film electric transport properties with microstructure
Author(s) -
Michael P. Siegal,
J. P. Podkaminer,
Ana L. Lima-Sharma,
Peter Anand Sharma,
Douglas L. Medlin
Publication year - 2019
Publication title -
journal of applied physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.699
H-Index - 319
eISSN - 1089-7550
pISSN - 0021-8979
DOI - 10.1063/1.5089647
Subject(s) - materials science , annealing (glass) , seebeck coefficient , thermoelectric effect , electrical resistivity and conductivity , microstructure , void (composites) , grain size , thermoelectric materials , temperature coefficient , composite material , grain boundary , thermal conductivity , physics , electrical engineering , thermodynamics , engineering
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