Open AccessMicro-architecture embedding ultra-thin interlayer to bond diamond and silicon via direct fusion
Author(s) -
Jong Cheol Kim,
JongSik Kim,
Yan Xin,
Jinhyung Lee,
Young-Gyun Kim,
Ghatu Subhash,
Rajiv K. Singh,
Arul Chakkaravarthi Arjunan,
Haigun Lee
Publication year - 2018
Publication title -
applied physics letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 1.182
H-Index - 442
eISSN - 1077-3118
pISSN - 0003-6951
DOI - 10.1063/1.5030580
Subject(s) - materials science , silicon , diamond , silicon on insulator , optoelectronics , thermal conductivity , spark plasma sintering , nanotechnology , substrate (aquarium) , microstructure , composite material , oceanography , geology
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