Open AccessA method for determining average damage depth of sawn crystalline silicon wafers
Author(s) -
Bhushan Sopori,
Srinivas Devayajanam,
Prakash Basnyat
Publication year - 2016
Publication title -
review of scientific instruments
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.605
H-Index - 165
eISSN - 1089-7623
pISSN - 0034-6748
DOI - 10.1063/1.4944792
Subject(s) - wafer , materials science , etching (microfabrication) , silicon , layer (electronics) , composite material , carrier lifetime , isotropic etching , optoelectronics
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