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Analysis of simulation methodology for calculation of the heat of transport for vacancy thermodiffusion
Author(s) -
William C. Tucker,
Patrick K. Schelling
Publication year - 2014
Publication title -
journal of applied physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.699
H-Index - 319
eISSN - 1089-7550
pISSN - 0021-8979
DOI - 10.1063/1.4887121
Subject(s) - vacancy defect , monatomic ion , computation , statistical physics , grout , yield (engineering) , atom (system on chip) , thermodynamics , physics , condensed matter physics , materials science , quantum mechanics , computer science , algorithm , composite material , embedded system

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