Design and fabrication of a CMOS-compatible MHP gas sensor
Author(s) -
Ying Li,
Jun Yu,
Hao Wu,
Zhenan Tang
Publication year - 2014
Publication title -
aip advances
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/1.4869616
Subject(s) - materials science , tungsten , cmos , resistor , temperature coefficient , fabrication , electrode , optoelectronics , heating element , etching (microfabrication) , silicon , thermal stability , contact resistance , layer (electronics) , electrical engineering , nanotechnology , composite material , voltage , chemistry , metallurgy , medicine , alternative medicine , organic chemistry , pathology , engineering
A novel micro-hotplate (MHP) gas sensor is designed and fabricated with a standard CMOS technology followed by post-CMOS processes. The tungsten plugging between the first and the second metal layer in the CMOS processes is designed as zigzag resistor heaters embedded in the membrane. In the post-CMOS processes, the membrane is released by front-side bulk silicon etching, and excellent adiabatic performance of the sensor is obtained. Pt/Ti electrode films are prepared on the MHP before the coating of the SnO2 film, which are promising to present better contact stability compared with Al electrodes. Measurements show that at room temperature in atmosphere, the device has a low power consumption of ∼19 mW and a rapid thermal response of 8 ms for heating up to 300 °C. The tungsten heater exhibits good high temperature stability with a slight fluctuation (<0.3%) in the resistance at an operation temperature of 300 °C under constant heating mode for 336 h, and a satisfactory temperature coefficient of resistance of about 1.9‰/°C
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