Fabrication of silicon nanotip arrays with high aspect ratio by cesium chloride self-assembly and dry etching | Zendy

Xinshuai Zhang | Zendy; Jing Liu | Zendy; Bo Wang | Zendy; Tianchong Zhang | Zendy; Futing Yi | Zendy

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Fabrication of silicon nanotip arrays with high aspect ratio by cesium chloride self-assembly and dry etching

Author(s) -

Xinshuai Zhang,

Jing Liu,

Bo Wang,

Tianchong Zhang,

Futing Yi

Publication year - 2014

Publication title -

aip advances

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.421

H-Index - 58

ISSN - 2158-3226

DOI - 10.1063/1.4869238

Subject(s) - dry etching , etching (microfabrication) , silicon , aspect ratio (aeronautics) , materials science , inductively coupled plasma , fabrication , nanotechnology , reactive ion etching , plasma etching , optoelectronics , plasma , physics , medicine , pathology , alternative medicine , layer (electronics) , quantum mechanics

Nanotip arrays with high aspect ratio, which have attracted much attention due to their potential applications, have been fabricated by many methods. Dry etching combined with self-assembly masks is widely used because of the convenience of dry etching and high throughput of self-assembly. In this paper, we report a method combining Cesium Chloride (CsCl) self-assembly with inductively coupled plasma (ICP) dry etching to fabricate silicon nanotip arrays with high aspect ratio and silicon nanotip arrays with aspect ratio 15 have been achieved after optimization of all parameters

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