Potential for normally-off operation from GaN metal oxide semiconductor devices based upon semi-insulating GaN
Author(s) -
Yusuke Sakai,
S. Lawrence Selvaraj,
Osamu Oda,
Takashi Egawa
Publication year - 2013
Publication title -
aip advances
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.421
H-Index - 58
ISSN - 2158-3226
DOI - 10.1063/1.4819245
Subject(s) - materials science , band diagram , optoelectronics , wide bandgap semiconductor , band gap , layer (electronics) , semiconductor , threshold voltage , acceptor , oxide , voltage , transistor , condensed matter physics , nanotechnology , electrical engineering , metallurgy , physics , engineering
The conditions for preparing normally-off GaN devices incorporating semi-insulating (SI) GaN materials are explored. The properties of SI GaN where carbon behaves as a deep level acceptor are predicted using a Shockley diagram. Metal-oxide-semiconductor (MOS) structures based upon these on SI-GaN layers are designed. The bandgap alignment of these structures is analyzed using Poisson equations. Normally-off operation is shown to be possible in devices featuring a thin n-GaN layer and SI-GaN layer, because of a higher conduction band energy. It is also shown that higher threshold voltage can be achieved by reducing the carrier concentration of the n-GaN channel layer
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