Influence of surface topology on the electrical response of many bead assemblies | Zendy

A. Tekaya | Zendy; R. Bouzerar | Zendy; V. Bourny | Zendy

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Influence of surface topology on the electrical response of many bead assemblies

Author(s) -

A. Tekaya,

R. Bouzerar,

V. Bourny

Publication year - 2012

Publication title -

aip advances

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.421

H-Index - 58

ISSN - 2158-3226

DOI - 10.1063/1.4738952

Subject(s) - creep , materials science , asperity (geotechnical engineering) , topology (electrical circuits) , voltage , bead , electrical contacts , process (computing) , contact resistance , composite material , electrical resistance and conductance , characterization (materials science) , nanotechnology , computer science , electrical engineering , engineering , layer (electronics) , operating system

We propose an interpretation of the voltage creep observed in metallic grain assemblies based on the sensitivity of the electrical properties to the surface topology of the beads. From the real area of contact between adjacent beads, directly measured through the bulk resistance of a single bead, we derive a simple relation between the voltage creep rate and the creep rate of the interface friction coefficient, regarded as an aging process expressing asperity creep. The likely influence of the Branly effect on the aging process is briefly discussed

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