Shock loading and release of a small angle tilt grain boundary in Cu
Author(s) -
Christian Brandl,
Timothy C. Germann
Publication year - 2011
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.3686519
Subject(s) - grain boundary , tilt (camera) , materials science , shock (circulatory) , boundary (topology) , electric shock , mechanics , composite material , geometry , physics , microstructure , mechanical engineering , mathematics , engineering , mathematical analysis , medicine
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