z-logo
open-access-imgOpen Access
Shock loading and release of a small angle tilt grain boundary in Cu
Author(s) -
Christian Brandl,
Timothy C. Germann
Publication year - 2011
Publication title -
osti oai (u.s. department of energy office of scientific and technical information)
Language(s) - English
Resource type - Conference proceedings
SCImago Journal Rank - 0.177
H-Index - 75
eISSN - 1551-7616
pISSN - 0094-243X
DOI - 10.1063/1.3686519
Subject(s) - grain boundary , tilt (camera) , materials science , shock (circulatory) , boundary (topology) , electric shock , mechanics , composite material , geometry , physics , microstructure , mechanical engineering , mathematics , engineering , mathematical analysis , medicine

The content you want is available to Zendy users.

Already have an account? Click here to sign in.
Having issues? You can contact us here
Accelerating Research

Address

John Eccles House
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom