Open AccessThermal conductance across grain boundaries in diamond from molecular dynamics simulation
Author(s) -
Taku Watanabe,
Boris Ni,
Simon R. Phillpot,
Patrick K. Schelling,
Pawel Keblinski
Publication year - 2007
Publication title -
journal of applied physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.699
H-Index - 319
eISSN - 1089-7550
pISSN - 0021-8979
DOI - 10.1063/1.2779289
Subject(s) - diamond , grain boundary , thermal conductivity , condensed matter physics , conductance , materials science , twist , thermal conduction , electrical conductor , grain size , molecular dynamics , electrical resistivity and conductivity , conductivity , physics , composite material , chemistry , geometry , microstructure , computational chemistry , mathematics , quantum mechanics
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