Open AccessComparative study on the thermal performance of surface‐mounted devices light‐emitting diode packaging with poly(1,4‐cyclohexylenedimethylene terephthalate) and epoxy moulding compound frames
Author(s) -
Zhao Dezhi,
Xiong Zhihua,
Chen Cong,
Niu Yunfei
Publication year - 2022
Publication title -
iet optoelectronics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.379
H-Index - 42
eISSN - 1751-8776
pISSN - 1751-8768
DOI - 10.1049/ote2.12044
Subject(s) - materials science , light emitting diode , epoxy , thermal , composite material , thermal resistance , lead frame , optoelectronics , electronic packaging , diode , semiconductor device , layer (electronics) , meteorology , physics
With the emergence of the different light‐emitting diode (LED) packaging materials, the thermal analysis of LED device packaging with different materials has become urgent. The thermal performance of LED packaging with a poly(1,4‐cyclohexylenedimethylene terephthalate) frame (PCT‐LED) and LED packaging with an epoxy moulding compound frame (EMC‐LED) were measured and simulated. The results show that compared with EMC‐LED, PCT‐LED has better optical and thermal performance. The luminous efficiency of PCT‐LED and EMC‐LED is 177.31 and 167.42 lm/W, respectively, under 150 mA at 25°C. PCT‐LED devices have a lower thermal resistance of 15.64°C/W compared with that of EMC‐LED, and under the different temperature and drive current conditions, the excellent thermal characteristic of PCT‐LED devices is significant. Moreover, all simulation results agree well with the experimental results, and the maximum temperature of PCT‐LED falls faster than that of EMC‐LED with a fluid flow rate by thermal simulation. However, EMC‐LED has better antiageing performance. These results are important to guide the application of PCT‐LEDs and EMC‐LEDs.