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Co‐packaged datacenter optics: Opportunities and challenges
Author(s) -
Minkenberg Cyriel,
Krishnaswamy Rajagopal,
Zilkie Aaron,
Nelson David
Publication year - 2021
Publication title -
iet optoelectronics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.379
H-Index - 42
eISSN - 1751-8776
pISSN - 1751-8768
DOI - 10.1049/ote2.12020
Subject(s) - software deployment , computer science , architecture , path (computing) , power (physics) , telecommunications , systems engineering , engineering , computer network , software engineering , physics , art , quantum mechanics , visual arts
High‐capacity, high‐density, power‐, and cost‐efficient optical links are undoubtedly of critical importance for datacenter infrastructure. However, the optics roadmap has come to a fork in the road: Is it right to continue on the tried and proven path of pluggable modules or is it time to adopt a new deployment model that involves co‐packaged optics? Herein, we aim to shed light on the trade‐offs involved, enabling technologies, paths to adoption, and potential impact on datacenter network architecture.

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