Open AccessElectronic‐photonic board as an integration platform for Tb/s multi‐chip optical communication
Author(s) -
Lamprecht Tobias,
Betschon Felix,
Bauwelinck Johan,
Van Kerrebrouck Joris,
Lambrecht Joris,
Gaul Holger,
Eichler Alexander,
Yin Xin
Publication year - 2021
Publication title -
iet optoelectronics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.379
H-Index - 42
eISSN - 1751-8776
pISSN - 1751-8768
DOI - 10.1049/ote2.12017
Subject(s) - transceiver , photonics , photonic integrated circuit , printed circuit board , chip , amplifier , multiplexing , optical communication , wavelength division multiplexing , electronic engineering , electrical engineering , optoelectronics , computer science , engineering , materials science , wavelength , cmos
Chip‐on‐board silicon photonics O‐band wavelength‐division multiplexing transceivers have been developed that will eventually enable high‐throughput on‐board optical communication for multi‐socket on‐board communication. This direct, any‐to‐any configuration yields low‐latency, low‐power optical communication among multiple compute nodes on the board. Silicon photonic transceiver chips are flip‐chipped on a polymer waveguide containing an electro‐optical circuit board using adiabatic coupling and then completed with driver and amplifier electronic chips. A transceiver assembly based on wire‐bond technology verifies 50 Gb/s operation per channel, and the flip‐chip version demonstrates the chip on‐board assembly techniques for compact on‐board transceivers.