Open AccessMicroembossed copper microchannel heat sink for high‐density cooling in electronics
Author(s) -
Li Xuanyang,
Chen Jing
Publication year - 2019
Publication title -
micro and nano letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.25
H-Index - 31
ISSN - 1750-0443
DOI - 10.1049/mnl.2019.0198
Subject(s) - heat sink , microchannel , materials science , tungsten , micro heat exchanger , heat flux , fabrication , heat transfer coefficient , heat transfer , heat spreader , electronics cooling , thermodynamics , metallurgy , nanotechnology , medicine , physics , alternative medicine , pathology
A microembossed copper microchannel heat sink was designed and fabricated for high‐density cooling in electronics. The microchannel width and aspect ratio were investigated to find out the optimised channel size for microembossing. The fabrication method was based on bulk copper forming including tungsten die inductively coupled plasma etching, hot copper microembossing, inlet/outlet ports punching and sealing. The heat dissipation performances were tested by ceramic heater. The maximum temperature decreased to ∼37°C under different heat fluxes, with the maximum temperature decreased by 69.2% at 50 W/cm 2 heat flux. The equivalent heat transfer coefficient reached the value of 6492 W/m 2 K. High‐power chip was used as heat source too. The maximum heat flux reached 304.8 W/cm 2 when the chip can still function properly at 90.5°C. High cooling performance with the micro‐heat sink proves that microembossing by tungsten die is an alternative process for microchannel heat sink fabrication with batch production and low cost. Taking advantages of simple fabrication process and reutilisation of tungsten die, the technology shows promising potentials in high‐density microcooling systems.