Open AccessMolecular dynamics simulation on notch sensitivity of nanocrystalline Cu
Author(s) -
Wu Hejun,
Tong Shang,
Zhou Jianqiu,
Zhang Feng,
Yang Baotong
Publication year - 2018
Publication title -
micro and nano letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.25
H-Index - 31
ISSN - 1750-0443
DOI - 10.1049/mnl.2018.5365
Subject(s) - nanocrystalline material , materials science , molecular dynamics , composite material , shear stress , sensitivity (control systems) , shear (geology) , enhanced data rates for gsm evolution , ultimate tensile strength , nanotechnology , chemistry , engineering , electronic engineering , computational chemistry , telecommunications
A molecular dynamics (MD) simulation was performed on the nanocrystalline (NC) Cu with an edge notch under tensile loadings, with focus on the notch sensitivity. With the increase of notch size, the dominant deformation of material changes from the shear strain, which spreads throughout the entire sample, to a single shear band, which is induced by the stress concentration at the notch root. At the same time, the samples move from notch‐insensitivity to notch‐sensitivity. These findings offer significant guidelines for the application of NC Cu in engineering.