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Impact of gate material engineering on ED‐TFET for improving DC/analogue‐RF/linearity performances
Author(s) -
Chandan Bandi Venkata,
Dasari Sushmitha,
Nigam Kaushal,
Yadav Shivendra,
Pandey Sunil,
Sharma Dheeraj
Publication year - 2018
Publication title -
micro and nano letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.25
H-Index - 31
ISSN - 1750-0443
DOI - 10.1049/mnl.2018.5131
Subject(s) - linearity , transconductance , electrical engineering , materials science , optoelectronics , capacitance , transistor , radio frequency , microwave , electrode , physics , engineering , telecommunications , voltage , quantum mechanics
To avoid the fabrication complexity and cost of nanoscale devices, a dual metal gate (DMG) in polarity controlled electrically doped tunnel field‐effect transistor (ED‐TFET) has been introduced first time for DC, analogue/radio frequency (RF) and linearity performance improvement. The formation of n+ drain and p+ source regions are done by applying polarity biases of PG‐1 as 1.2 V and PG‐2 as −1.2 V, respectively, over the silicon body in DMG‐ED‐TFET. Different analogue/RF and linearity performance metrics of DMG‐ED‐TFET are evaluated using ATLAS device simulator and compared with that of ED‐TFET. The figure of merits (FOMs) studied in this work for DMG‐ED‐TFET are in terms of transconductance, gate‐to‐drain capacitance, gain bandwidth product, cut‐off frequency and linearity parameters such as third‐order transconductance coefficient ( g m 3 ), VIP3, IIP3 and IMD3. From the simulations, it is found that DMG‐ED‐TFET achieves significant improvement in these FOMs as compared to ED‐TFET due to introduction of dual metal at gate electrode (gate workfunction engineering). The work has also optimised the proposed device to attain optimum analogue/RF and linearity performance.

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