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Single‐mask fabrication of micro‐probe electrode array with various tip heights and sharpness using isotropic and anisotropic etching
Author(s) -
Shin Youngmin,
Kim YongKweon,
Lee SeungKi,
Park JaeHyoung
Publication year - 2018
Publication title -
micro and nano letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.25
H-Index - 31
ISSN - 1750-0443
DOI - 10.1049/mnl.2018.5064
Subject(s) - deep reactive ion etching , materials science , reactive ion etching , etching (microfabrication) , surface micromachining , electrode , bulk micromachining , fabrication , isotropy , anisotropy , silicon , optoelectronics , conical surface , microfabrication , optics , nanotechnology , layer (electronics) , composite material , chemistry , medicine , alternative medicine , physics , pathology
In this work, a silicon‐based micro‐probe array was fabricated using multi‐step deep reactive ion etching (DRIE) and reactive ion etching (RIE) processes. The micro‐probe structure was implemented using a micromachining technique through a combination of two anisotropic DRIE and two isotropic RIE processes with a single etch mask. The cone‐shaped tip height and tapered tip‐end angle were experimentally varied with respect to the first DRIE depth. As the first DRIE depth was decreased, the micro‐probe tip height increased and the sharpness consequently improved. The conductive layer was exposed only at the tip ends of the micro‐probe to form a conical ultra‐micro electrode, and it was characterised via cyclic voltammetry measurements.

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