Open AccessNon‐close packaged monolayer of silica nanoparticles on silicon substrate using HF vapour etching
Author(s) -
Van Minh Nguyen,
Son Nguyen Ngoc,
Lien Nghiem Thi Ha,
Hoang Chu Manh
Publication year - 2017
Publication title -
micro and nano letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.25
H-Index - 31
ISSN - 1750-0443
DOI - 10.1049/mnl.2016.0825
Subject(s) - monolayer , substrate (aquarium) , materials science , silicon , etching (microfabrication) , nanoparticle , nanotechnology , chemical engineering , dry etching , optoelectronics , layer (electronics) , engineering , oceanography , geology
Ordered monolayer of silica nanoparticles assembled on solid substrates is useful for a variety of promising applications in photonics, plasmonics, and solar cell. Nanoparticles are usually assembled into close‐ or non‐close‐packed monolayer (CPM) form. The non‐close packed monolayer can be directly deposited from mono‐dispersed colloidal suspension onto a solid substrate in terms of using complicated techniques or tuning the size of nanoparticles in the CPM. An effective method for forming the non‐close packed monolayer of silica nanoparticles is reported. Silica nanoparticles are self‐assembled into the CPM on silicon substrate. The size of silica nanoparticles is tuned by high frequency vapour etching. The dependence of the size and shape of silica nanoparticles on etching time is presented. The effect of sintering conditions on the etching process is also investigated.