Open AccessReliable and high quality adhesive bonding for microfluidic devices
Author(s) -
Li Jingmin,
Liang Chao,
Zhang Hao,
Liu Chong
Publication year - 2017
Publication title -
micro and nano letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.25
H-Index - 31
ISSN - 1750-0443
DOI - 10.1049/mnl.2016.0478
Subject(s) - adhesive , microchannel , materials science , anodic bonding , microfluidics , adhesive bonding , pressing , fabrication , composite material , mold , wire bonding , wafer bonding , thermocompression bonding , layer (electronics) , nanotechnology , optoelectronics , wafer , chip , computer science , medicine , telecommunications , alternative medicine , pathology
Some issues, such as the removing of air bubbles from bonding interface, microchannel clogging by adhesive, the methods to increase bonding efficiency, as well as the adhesive bonding of a multilayer chip, still limit the use of adhesive bonding in the mass fabrication of microfluidic devices. In this work, an automatic adhesive bonding machine is developed which can obviously increase bonding efficiency and quality as compared with the traditional manually methods. A bonding method which uses a soft pressing head to extrude the air bubbles from bonding interface is presented. The relationship between the adhesive film thickness and the channel clogging is investigated. The adhesive bonding of three types of two‐layer microfluidic devices and a five‐layer microfluidic device are studied. Results have shown that the uses of the soft pressing head can effectively removing the air bubbles from the bonding interface. The bonding ratios of all devices are above 95%. The channel residual depth, which is the channel depth excluding the protrusion height of the adhesive film within the channel, will increase to follow the increase in microchannel width and adhesive film thickness.