Open AccessHeat removal capacity enhanced micropin array heatsink with optimised pin height and inlet–outlet positions
Author(s) -
Yang Dawei,
Ding Guifu,
Wang Yan,
Zhao Junhong,
Wang Guilian
Publication year - 2016
Publication title -
micro and nano letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.25
H-Index - 31
ISSN - 1750-0443
DOI - 10.1049/mnl.2015.0513
Subject(s) - inlet , heat sink , materials science , computational fluid dynamics , mechanics , mechanical engineering , engineering , physics
A micropin array heatsink with high heat removal capacity for its optimised pin height and inlet–outlet positions is presented. Computational fluid dynamics simulation indicates pin height has a big impact on the pressure difference and heat removal capacity. A decrease of 2.67°C of the maximum temperature was achieved when pin height increased from 200 to 500 µm. Meanwhile with the proper pin height, the different positions of inlet and outlet that the maximum temperature decreases 13.89°C, the best design compared with the worst design among 63 samples under the same working condition. The two typical samples were fabricated and tested through micromachining technology and an infrared imaging testing system. Experiment result preferably matches with the simulation result of the same variation trend of 5.8°C. The positions of inlet and outlet were proved to play an important role in enhancing the heat removal capacity of the micropin array heatsink.