Open AccessFabrication and thermal stability characterisation of Ru electrode used for high power contact radio frequency microelectromechanical system switch
Author(s) -
Zhang Hongze,
Wang Wei,
Li Zhihong
Publication year - 2013
Publication title -
micro and nano letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.25
H-Index - 31
ISSN - 1750-0443
DOI - 10.1049/mnl.2013.0300
Subject(s) - materials science , electrode , fabrication , microelectromechanical systems , thermal stability , optoelectronics , bilayer , scanning electron microscope , thermal , electrical contacts , composite material , chemical engineering , chemistry , membrane , medicine , alternative medicine , physics , pathology , meteorology , engineering , biochemistry
Reported are the fabrication and thermal stability of an Ru electrode, which is used for a high power Ru–Au contact radio frequency microelectromechanical system switch with a microspring contact design. In this reported work, a new process with bilayer lift‐off and a strain release layer is developed, thereby acquiring the 3000 Å Ti/Au/Ru electrode with excellent smooth edges for high‐power handling capacity and low loss. Furthermore, thermal tests under 400, 500 and 600°C for over 1 h have been performed. Investigation of the surface with scanning electron microscopy and energy dispersive X‐ray spectroscopy shows that the electrode has a good thermal stability at 400°C, which is proper for high‐power handling. The cold switch DC current handling capacity is advanced from <90 mA per point (failed) to 100 mA per point (still working).