Open AccessNovel pure‐metal tri‐axis CMOS‐MEMS accelerometer design and implementation
Author(s) -
Wen JungHung,
Fang Weileum
Publication year - 2021
Publication title -
micro and nano letters
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.25
H-Index - 31
ISSN - 1750-0443
DOI - 10.1049/mna2.12014
Subject(s) - proof mass , microelectromechanical systems , accelerometer , cmos , materials science , diagonal , etching (microfabrication) , chip , electrode , proof of concept , electrical conductor , optoelectronics , calibration , electronic engineering , electrical engineering , computer science , engineering , nanotechnology , physics , composite material , layer (electronics) , geometry , mathematics , quantum mechanics , operating system
This work proposed a pure‐metal, single‐proof‐mass structure fabricated by the standard 0.18 μm one‐poly‐silicon six‐metal (1P6M) CMOS process along with one in‐house post‐CMOS wet‐etching approach. The implemented state‐of‐the‐art symmetrical tri‐axis accelerometer consists of the disk‐like mezzanine proof‐mass and four diagonal double‐layered springs. Three sets of the addressable quadrant electrodes underneath the proof‐mass with additional interlayer inter‐digital comb‐conductors help to fulfil the high sensibilities of 248.6, 250.8, and 220.1 mV/G for the x ‐, y ‐, and z ‐axes, respectively. Symmetrical‐structure and addressable‐electrode design of the device also effectively eliminates the cross‐coupling effects. The thin‐film composite springs can be width‐trimmed for the necessities of specification changes, and the optional calibration pads also provide the on‐chip accuracy compensations. The fabricated tri‐axis accelerometer reveals stable and consistent results and exemplifies a potential platform design for the highly integrated monolithic CMOS‐MEMS system‐on‐chip applications.