Open AccessWideband transition from substrate integrated waveguide to rectangular waveguide in K‐band by width profiling
Author(s) -
Fu Yunhao,
Gong Liang,
Chan King Yuk,
Ramer Rodica
Publication year - 2020
Publication title -
iet microwaves, antennas and propagation
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.555
H-Index - 69
eISSN - 1751-8733
pISSN - 1751-8725
DOI - 10.1049/iet-map.2019.0801
Subject(s) - wideband , return loss , profiling (computer programming) , materials science , impedance matching , bandwidth (computing) , fractional bandwidth , electrical impedance , waveguide , fabrication , optics , optoelectronics , electronic engineering , computer science , physics , telecommunications , engineering , electrical engineering , medicine , operating system , alternative medicine , resonator , pathology , antenna (radio)
A wideband in‐line substrate integrated waveguide‐to‐rectangular waveguide transition in K‐band is proposed. A novel 1:2 E ‐plane step is developed as a building block. The entire transition consists of the 1:2 E ‐plane step, a multilayer transition based on the 1:2 E ‐plane step, and a taper. Impedance matching is achieved by profiling the widths of the structure along the midline, which is different from the traditional configurations with height profiling. The proposed method provides good impedance matching in the transition with identical steps, and from the authors’ best knowledge, has not been presented yet. The method of width profiling and the features of identical steps in the stacked structure allow the fabrication of not only metal but also identical printed circuit board panels. As a trade‐off, the cascaded network increases the length with reduced bandwidth potentially. For demonstration, a prototype is fabricated and tested. The measurement of the back‐to‐back configuration agrees with the simulation, revealing a measured return loss of 15 dB from 20.14 to 25.84 GHz.