Open AccessModelling of crosstalk in differential through silicon vias for three‐dimensional integrated circuits
Author(s) -
Pan JinWei,
Fu Kai,
Liu Qi,
Zhao WenSheng,
Dong Linxi,
Wang Gaofeng
Publication year - 2019
Publication title -
iet microwaves, antennas and propagation
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.555
H-Index - 69
eISSN - 1751-8733
pISSN - 1751-8725
DOI - 10.1049/iet-map.2018.5297
Subject(s) - crosstalk , electronic engineering , equivalent circuit , hfss , solver , integrated circuit , electronic circuit , materials science , engineering , electrical engineering , computer science , voltage , microstrip antenna , antenna (radio) , programming language
The crosstalk effects of differential through silicon vias (D‐TSVs) are studied. The equivalent circuit model is developed, with the circuit elements extracted analytically. Using the three‐dimensional (3D) full‐wave field solver HFSS, the circuit model is validated up to 100 GHz. By virtue of the circuit model, the noise couplings in the D‐TSVs are evaluated. It is found that the noise coupling can be cancelled in the D‐TSVs for a particular case. Finally, the influence of floating silicon substrate on the crosstalk in the D‐TSVs is investigated.