
Improvement of on‐wafer measurement accuracy with RF signal detection technique at millimetre‐wave frequencies
Author(s) -
Sakamaki Ryo,
Horibe Masahiro
Publication year - 2017
Publication title -
iet microwaves, antennas and propagation
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.555
H-Index - 69
eISSN - 1751-8733
pISSN - 1751-8725
DOI - 10.1049/iet-map.2017.0206
Subject(s) - millimetre wave , wafer , signal (programming language) , radio frequency , materials science , electronic engineering , optoelectronics , extremely high frequency , radio signal , optics , electrical engineering , computer science , physics , engineering , programming language
The study proposes an innovative method of improving calibration reproducibility in on‐wafer measurements. First, an uncertainty analysis was conducted on a measurement system. Based on the analysis results, the probe positional error in the X , Y , and Z axes was considered the dominant error factor. In the proposed calibration process, the positions of the contact probes are adjusted in relation to defined origin coordinates that establish the electrical centre of the thru standard. Standard deviations of the measurements of short, load, and thru devices were significantly decreased using the proposed calibration system, indicating significant improvement in the stability of the calibration process. The proposed method also demonstrated the improvement of calibration reproducibility in a 75 Ω mismatched line device, compared to calibrations using conventional processes. The proposed calibration process is expected to contribute to eliminating operator dependence due to variation in the probe position in on‐wafer measurements, and can potentially be applied to evaluations of a wide variety of planar circuits.