Open AccessNon‐unicity of the electric near‐field planar emission model with dipole array
Author(s) -
Ravelo Blaise
Publication year - 2017
Publication title -
iet microwaves, antennas and propagation
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.555
H-Index - 69
eISSN - 1751-8733
pISSN - 1751-8725
DOI - 10.1049/iet-map.2016.0910
Subject(s) - planar , microstrip , dipole , matlab , printed circuit board , plane wave , near and far field , microwave , electric field , computational physics , acoustics , electronic engineering , computer science , physics , optics , engineering , electrical engineering , telecommunications , computer graphics (images) , quantum mechanics , operating system
This study deals with the behavioural modelling of the planar electric‐ (E‐) near‐field (NF) emission from electronic printed circuit boards. The methodology indicating how to synthesise the model from the given scanned E‐NF maps in the observation plane of interest is established. The modelled radiation source is built with exclusively E‐dipole array whose components are determined by the inverse method. After computational routine algorithm Matlab implementation, the proposed model was validated with various demonstrators. Relevant verifications were performed at different operating frequencies with the E‐NF emission from analytical radiation, measurement scanning with active complex RF PCB and full wave simulation with microwave passive microstrip structure. It was shown that the model enables to reproduce the equivalent source with relative error vector magnitude accuracy less than 3%. The error analyses in function of the distance between the observation plane and the radiating PCB were proposed. Moreover, the non‐unicity and limit of the model with the E‐field emission prediction from different E‐field radiated data defined in the scanning observation surface plane positions from the radiating circuit. The developed model can be potentially used to lower the cost of EM compatibility engineering during the electronic PCB design phase.