Open AccessVisual wafer dies counting using geometrical characteristics
Author(s) -
Xu Shaoqiu,
Cheng Zhihang,
Gao Yang,
Pan Qing
Publication year - 2014
Publication title -
iet image processing
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.401
H-Index - 45
eISSN - 1751-9667
pISSN - 1751-9659
DOI - 10.1049/iet-ipr.2013.0392
Subject(s) - wafer dicing , ransac , wafer , sample (material) , computer science , artificial intelligence , visual inspection , die (integrated circuit) , computer vision , engineering drawing , algorithm , image (mathematics) , engineering , electrical engineering , chemistry , chromatography , operating system
This study presents a computer vision‐based wafer dies counting algorithm. It utilises the single model and multi‐model RANSAC (Random Sample Consensus) algorithms to detect the circular contour of a wafer and its dicing lanes, respectively. Statistical analysis is performed to extract the characteristics of layout so that missed dicing lanes can be supplemented. The number of integral dies is counted after segmenting individual dies based on the complete layout information. The experimental results show that the proposed algorithm has high counting accuracy and good computational efficiency.