
Thermal behaviour analyses of gas‐insulated switchgear compartment using thermal network method
Author(s) -
Stosur Mariusz,
Szewczyk Marcin,
Sowa Kacper,
Dawidowski Pawel,
Balcerek Przemyslaw
Publication year - 2016
Publication title -
iet generation, transmission and distribution
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.92
H-Index - 110
eISSN - 1751-8695
pISSN - 1751-8687
DOI - 10.1049/iet-gtd.2015.0489
Subject(s) - switchgear , emtp , reliability (semiconductor) , software , reliability engineering , thermal , component (thermodynamics) , computer science , simulation software , engineering , electric power system , mechanical engineering , power (physics) , physics , thermodynamics , quantum mechanics , meteorology , programming language
In development of electric power products, aspects related to thermal phenomena are becoming very important due to the fact that they guarantee the correct operation of product. The temperature limits specified by the standards cannot be exceeded which makes the knowledge of the temperature behaviour an important factor in order to predict reliability and performance of the product component in its working environment. In this study, thermal network method (TNM) is used for modelling of temperature conditions in typical geographical information system (GIS) compartment arrangements. Models implemented in ATP–EMTP software were validated with OrCAD Capture simulation environment and with high‐current measurement results. On the bases of the TNM presented as the network approach composed of heat sources, thermal resistances and capacitances which can be easily represented and calculated by means of ATP–EMTP simulation software and also with the OrCAD Capture environment. This study addresses the thermal behaviour of a standard ELK‐3 GIS compartment. Modelling in application to design rating calculations of the typical GIS compartment arrangements are presented and analysed. These analyses can serve as a base for development of more advanced ATP–EMTP models using the TNM approach.