Open AccessInvestigation of the improvement of signal integrity in electrical circuits with degraded contacts using differential transmission
Author(s) -
Wang Ziren,
Gao Jinchun,
Flowers George T.,
Bi Lingyu,
Xie Gang,
Zhou Yilin
Publication year - 2019
Publication title -
iet circuits, devices and systems
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.251
H-Index - 49
eISSN - 1751-8598
pISSN - 1751-858X
DOI - 10.1049/iet-cds.2018.5178
Subject(s) - signal integrity , cable gland , backplane , electronic engineering , electronic circuit , signal (programming language) , reliability (semiconductor) , transmission (telecommunications) , degradation (telecommunications) , computer science , materials science , printed circuit board , electrical engineering , engineering , computer hardware , telecommunications , power (physics) , physics , quantum mechanics , programming language
High‐speed backplane connectors are extensively used in digital baseband communication circuits. Connector degradation may lead to deterioration of the integrity of digital signals and is one of the major causes of low communication quality. In this study, an accelerated test was used to produce degraded connector samples. Based on the degradation characteristics of the connector electrical contact surface, the differential transmission method was applied to enhance signal integrity in such degraded electrical contact circuits. Referring to the Gigabit Ethernet standard, the differential signal waveforms and eye diagrams of high‐speed channels with un‐degraded and degraded connectors were studied. Improvement of the circuit reliability by differential transmission was demonstrated from the perspectives of both experimental investigations and analysis using probability calculations.