Open AccessThermal properties of graphene and few‐layer graphene: applications in electronics
Author(s) -
Yan Zhong,
Nika Denis L.,
Balandin Alexander A.
Publication year - 2015
Publication title -
iet circuits, devices and systems
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.251
H-Index - 49
ISSN - 1751-8598
DOI - 10.1049/iet-cds.2014.0093
Subject(s) - graphene , materials science , thermal conductivity , electronics , reliability (semiconductor) , transistor , thermal , optoelectronics , nanotechnology , graphene nanoribbons , phonon , thermal management of electronic devices and systems , layer (electronics) , power density , engineering physics , composite material , power (physics) , mechanical engineering , electrical engineering , condensed matter physics , engineering , thermodynamics , physics , voltage
The authors review thermal properties of graphene and few‐layer graphene (FLG), and discuss applications of these materials in thermal management of advanced electronics. The intrinsic thermal conductivity of graphene – among the highest of known materials – is dominated by phonons near the room temperature. The examples of thermal management applications include the FLG heat spreaders integrated near the heat generating areas of the high‐power density transistors. It has been demonstrated that FLG heat spreaders can lower the hot‐spot temperature during device operation, resulting in improved performance and reliability of the devices.